E SC 214
Patterning for Nanotechnology (3) Lithographic process from substrate preparation to exposure; process from development through inspection; advanced optical lithographic techniques.
E SC 214 Lithography for Nanotechnology (3)
This course is an exposure to all aspects of advanced pattern transfer and pattern transfer equipment including probe techniques; stamping and embossing; e-beam; and optical contact and stepper systems. The course is divided into five major sections. The first section is an overview of all pattern generation processes covering aspects from substrate preparation to tool operation. The second section concentrates on photolithography and examines such topics as mask template, and mold generation. Chemical makeup of resists will be discussed including polymers, solvents, sensitizers, and additives. The role or dyes and antireflective coatings will be discussed. In addition, critical dimension (CD) control and profile control of resists will be investigated. The third section will discuss the particle beam lithographic techniques such as e-beam lithography. The fourth section covers probe pattern generation and the fifth section explores embossing lithography, step-and-flash, stamp lithography, and self assembled lithography.
Note : Class size, frequency of offering, and evaluation methods will vary by location and instructor. For these details check the specific course syllabus.